R&D Scientist – Advanced Semiconductor Chip Packaging, Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
... (international) customers in collaborative projects Competenties MSc in Mechanical/Electrical Engineering, Materials Science, or Physics 5+ years of R&D experience in advanced chip packaging (fan-out is a plus) Expertise in reliability testing and modeling Proactive and hands-on approach with strong organizational skills Skilled in data analysis and technical communication Fluent in English (written and spoken)
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