About Us: Welcome to CITC – Chip Integration Technology Center! We are a non-profit, joint innovation hub specializing in heterogeneous integration and advanced chip packaging technologies. At CITC, we foster a vibrant ecosystem where companies, research institutions, and educational bodies collaborate to bridge the gap between academia and industry. Together, we are pioneering the next generation of smart, safe, and durable chip packages.
Our mission is to provide access to cutting-edge innovation, infrastructure, and education, with the goal of becoming a leading partner in semiconductor and photonics packaging. Established in 2019 with strategic partners TNO and Delft University of Technology, and supported by local and regional governments, CITC is ideally located on the Noviotech Campus in Nijmegen, at the heart of the Dutch semiconductor industry.
Our Advanced Packaging Platform: CITC is at the forefront of packaging technology development with its own fan-out packaging platform, leveraging years of expertise in large-area processing for thin-film electronics and additive manufacturing. Our state-of-the-art facilities include a back-end lab in Nijmegen and clean rooms for thin-film processing and additive manufacturing at TNO premises in Eindhoven.
Your Role: As a key member of our team, you will develop advanced chip packaging technologies for a wide range of high-end applications, from automotive radar to photonics and power electronics. You will be involved in the design, realization, and characterization of next-generation advanced packages. Working at the intersection of material science, packaging technology, and microelectronics, you will thrive in a multidisciplinary research environment alongside industry partners. Your work will include conducting experiments and modelling to develop and demonstrate novel processes, with a strong focus on manufacturability and reliability. Additionally, you will engage directly with customers, translating industry needs into technology development.
Let op: This role is primarily based in Nijmegen, but you will also work occasionally in Eindhoven ( 1 a max 2 dagen per week)
Functie-eisen
•Design, fabricate, and conduct reliability testing of advanced packages
•Participate in technology and process development, and generate IP
•Contribute expertise and take responsibility in projects with (international) customers
Competenties
•MSc degree in mechanical engineering, electrical engineering, materials science, or physics
•At least 5 years of experience in R&D in the advanced chip packaging domain (experience with fan-out technologies is a plus)
•Expertise in reliability testing and modelling techniques
•A hands-on mentality with the ability to organize practical work efficiently and cooperatively
•Proficiency in data handling, analysis, and communication of results
•Excellent communication skills in English
Uiteraard staat deze vacature open voor iedereen die zich hierin herkent.
contact
Busra Yardim
busra.yardim@yacht.nl
06-51172353
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