About CITC:
The Chip Integration Technology Center (CITC) is a non-profit innovation hub specializing in heterogeneous integration and advanced chip packaging. Located in the heart of the Dutch semiconductor industry, we bring together companies, research institutions, and academia to develop the next generation of smart, reliable, and high-performance chip packages.
Your Role:
As an R&D Scientist at CITC, you will contribute to the development of advanced chip packaging technologies for cutting-edge applications in automotive radar, photonics, and power electronics. You will work on design, fabrication, testing, and modeling of innovative packaging solutions, with a strong focus on reliability and manufacturability. Collaborating closely with industry partners, you’ll help translate market needs into practical technologies.
Functie-eisen
Key Responsibilities:
- Design and develop next-generation advanced packages (e.g., fan-out technologies)
- Perform reliability testing and modeling
- Support technology and process development, including IP generation
- Work directly with (international) customers in collaborative projects
Competenties
- MSc in Mechanical/Electrical Engineering, Materials Science, or Physics
- 5+ years of R&D experience in advanced chip packaging (fan-out is a plus)
- Expertise in reliability testing and modeling
- Proactive and hands-on approach with strong organizational skills
- Skilled in data analysis and technical communication
- Fluent in English (written and spoken)
Uiteraard staat deze vacature open voor iedereen die zich hierin herkent.
contact
Nikhil Kumar
nikhil.kumar@yacht.nl
020 519 7007
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Je sollicitatie en cv worden doorgenomen door Nikhil Kumar
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